Company Name: OmniVision Integrated Circuits Group, Inc.

Date of Prospectus: December 31, 2025

OmniVision Integrated Circuits Group, Inc. Launches Landmark Hong Kong IPO: Key Investment Insights, Structure, and Outlook

IPO Snapshot: Pricing, Shares, and Allocation

OmniVision Integrated Circuits Group, Inc. is set to debut on the Hong Kong Stock Exchange under the symbol 0501, offering investors exposure to one of the leading integrated circuit solution providers in the region. The IPO represents a significant opportunity for both institutional and retail investors eager to participate in the semiconductor and technology sector.

• Offer Price: Maximum HK\$104.80 per H Share (subject to downward adjustment on pricing date)
• Total Offer Size: 45,800,000 H Shares (subject to over-allotment option)
• Hong Kong Offer Shares: 4,580,000 H Shares (subject to reallocation)
• International Offer Shares: 41,220,000 H Shares (subject to reallocation and over-allotment)
• Nominal Value: RMB 1.0 per H Share
• Stock Code: 0501
• Over-allotment Option: Up to 6,870,000 additional H Shares (15% of the initial offering size)

Offer period: December 31, 2025 to January 7, 2026

Expected listing date: January 12, 2026

Board Lot Size: 100 H Shares

Application Minimum: 100 H Shares per application (see table below for payment amounts)

Application channels: HK eIPO White Form (www.hkeipo.hk), HKSCC EIPO channel (through brokers/custodians via FINI system)

Physical application channels: Not provided; fully electronic application process

Refunds: If final price is lower than the maximum, refunds will be processed on January 12, 2026

Settlement: CCASS eligible from Listing Date; H Shares to be traded in board lots of 100

Use of Proceeds: Growth-Driven Capital Deployment

OmniVision is focused on leveraging IPO proceeds for accelerated growth and expansion. While specific allocations by amount are not detailed, the prospectus clearly signals that capital raised will be directed toward strategic initiatives including:

• Research & Development: Advancing core integrated circuit technologies
• Capacity Expansion: Scaling manufacturing and supply chain capabilities
• Working Capital: Supporting ongoing operations and market expansion
• Potential M&A: Exploring growth opportunities within the sector

This suggests a clear growth-driven story, with emphasis on innovation and scaling operations for competitive advantage.

Placement Structure: Public, Institutional, and Over-allotment Mechanisms

The offering is split between a Hong Kong Public Offering (retail) and an International Offering (institutional).

• Hong Kong Public Offering: Initially 4,580,000 H Shares (10% of offer), can be increased up to 6,870,000 H Shares (15%) via reallocation if oversubscribed
• International Offering: 41,220,000 H Shares (90% of offer), subject to over-allotment and reallocation
• Over-allotment Option (Greenshoe): Up to 6,870,000 additional shares (15%) to cover excess demand

Reallocation follows Mechanism B under Chapter 4.14 of the Guide for New Listing Applicants, with clawback only if the Hong Kong Public Offer is oversubscribed.

Investor Participation and Book Quality

High-quality book building is expected, given the involvement of prominent underwriters and global coordinators.

• Joint Sponsors, Overall Coordinators, Joint Global Coordinators, Joint Bookrunners and Joint Lead Managers: UBS, CICC, PASCHK, GF Securities, Haitong International, CITIC Securities, TMS
• Stabilization Manager: China International Capital Corporation Hong Kong Securities Limited

The presence of leading global investment banks and stabilizing mechanisms implies strong support for listing-day performance.

Oversubscription metrics by tranche and anchor investor names are not disclosed; allocation will be announced on January 9, 2026.

Company Overview: Business Model and Strategic Position

OmniVision Integrated Circuits Group, Inc. is a PRC-incorporated joint stock company specializing in integrated circuit design, manufacturing, and solutions.

• Key Products/Services: Integrated circuit solutions for imaging, sensor, and other semiconductor applications
• Revenue Streams: Product sales, licensing, and service contracts
• Customer Segments: Electronics manufacturers, device OEMs, and technology integrators
• Geographies: Primary operations in China, with international customer base

Sector: Semiconductor/Integrated Circuits

Industry Size and Market Share: Not specifically quantified in the prospectus

Competitive Advantages: Advanced technology, established customer relationships, and scalable production capabilities

Management Team:

• Chairman & Executive Director: Mr. YU Renrong
• Executive Directors: Mr. WU Xiaodong, Mr. JIA Yuan, Ms. QIU Huanping
• Non-Executive Directors: Mr. LYU Dalong, Ms. CHEN Yu
• Independent Non-Executive Directors: Mr. ZHU Liting, Ms. FAN Mingxi, Mr. MOU Lei

Sector Trends, IPO Timing, and Market Environment

The IPO is well-timed, aligning with ongoing sector growth in semiconductors and increasing demand for integrated circuit solutions.

• IPO Application Window: December 31, 2025 (9:00 a.m.) to January 7, 2026 (12:00 noon)
• Price Determination Date: January 8, 2026
• Listing Date: January 12, 2026
• Announcement of Allocation Results: January 9, 2026
• Settlement and Refunds: January 12, 2026

Economic Environment: The prospectus highlights robust investor interest and favorable macro conditions for technology and semiconductor stocks.

Recent Developments: Expansion of product portfolio and strategic investments in R&D and capacity

Market conditions for this IPO appear favorable, based on sector demand and listing timing.

Risk Factors: Key Exposures and Considerations

Investors should assess the following risks, as outlined in the prospectus:

• Regulatory Risks: Compliance with Hong Kong and PRC securities laws; risks relating to listing approval and CCASS eligibility
• Market Price Volatility: Limited stabilization period (30 days post-application close), after which share prices may decline
• Demand and Oversubscription: Potential for oversubscription in the retail tranche, resulting in reallocation and possible price volatility
• Operational Risks: Capacity expansion, supply chain management, and R&D execution
• No guarantee of dividend payout or specific ratio

Quantified exposures are not disclosed in the prospectus.

Growth Strategy: Expansion, Innovation, and Market Leadership

OmniVision’s growth strategy prioritizes:

• Advancing R&D: Developing next-generation integrated circuit technologies
• Scaling Production: Increasing manufacturing capacity to meet rising demand
• Market Expansion: Entering new geographies and customer segments
• Strategic M&A: Pursuing acquisitions to enhance product offerings and market share

Timelines for capex and expansion initiatives are not specified in the prospectus.

Ownership and Lock-up Structure

Pre- and post-IPO shareholding structure, promoter holdings, and ESOP details are not explicitly disclosed in the prospectus.

No analyst or covering institution opinions or price targets are included in the prospectus.

Final subscription results will be published on January 9, 2026 at www.hkexnews.hk and www.omnivision-group.com.

Listing Outlook: Investment Potential and First-Day Performance

Based strictly on disclosed offering structure, demand drivers, and the presence of major investment banks and stabilization mechanisms, OmniVision Integrated Circuits Group, Inc.’s IPO appears likely to attract substantial investor interest and perform strongly on its first trading day.

• Strong institutional support and stabilization options suggest limited downside risk during the initial trading period.
• Sector momentum and favorable timing enhance listing prospects.
• First-day trading range is expected to stay close to or above the offer price of HK\$104.80, with potential for a robust debut depending on final allocation results and overall demand.

Based on all disclosed factors, the IPO appears attractive for subscribers seeking exposure to the growing semiconductor sector.

Prospectus Access

Prospectus and allocation results will be posted at www.hkexnews.hk and www.omnivision-group.com

How to Apply for OmniVision IPO Shares

Applications are accepted exclusively through electronic channels:

• HK eIPO White Form service: www.hkeipo.hk (for applicants wishing to receive physical share certificates in their own name)
• HKSCC EIPO channel: Via brokers or custodians participating in HKSCC FINI system (for shares to be credited to CCASS accounts)

Application Window: December 31, 2025 (9:00 a.m.) to January 7, 2026 (12:00 noon)

Minimum Application: 100 H Shares

Allotment results, refunds, and settlement details will be announced and processed according to the timetable outlined above.