Company Name: Suzhou Novosense Microelectronics Co., Ltd.

Date of Prospectus: November 28, 2025

Suzhou Novosense Microelectronics IPO (02676 HK): In-Depth Analysis, Offer Details, and Market Outlook

Suzhou Novosense Microelectronics Co., Ltd. is bringing its Hong Kong IPO (stock code: 02676) to market, aiming to capture investor interest amid dynamic industry trends and a robust regional capital markets environment. This deep-dive offers a comprehensive breakdown of the IPO’s key terms, offer structure, financial implications, and market prospects—addressing everything investors, analysts, and market watchers need to know.

IPO Snapshot: Terms, Pricing, and Offer Details

Summary: The Suzhou Novosense Microelectronics IPO is structured for both public and institutional participation, with a focus on maximizing accessibility and liquidity for investors.

Key Dates:

• Application Cut Off: Dec 2, 2025 (12:00 NOON for financing; 4:00 PM for full deposit)
• Allocation Announcement: Dec 5, 2025 (Friday)
• Refund Date: Dec 4, 2025 (Thursday)
• Dealing Commences: Dec 8, 2025 (Monday)

Financing Terms: Up to 90% financing available, with an indicative interest rate of 0% p.a. and no minimum application amount for margin financing [[1]].

Use of Proceeds and Strategic Direction

Summary: The allocation of funds from the IPO is positioned to support the company’s growth trajectory, expansion initiatives, and business development. (Inferred based on typical IPO practice; precise breakdown not disclosed in the available document.)

Investor Takeaway: The fundraising approach and strategic use of proceeds indicate a growth-oriented story, signaling further scaling and product development for Suzhou Novosense Microelectronics.

Placement, Allocation, and Book Quality

Summary: The IPO includes a balanced allocation between public and institutional investors, with an over-allotment (greenshoe) option built in to support aftermarket stability.

• Public Offer: 1,906,900 H Shares (subject to reallocation)
• Over-allotment Option: Available to increase flexibility and support price stabilization

Charges:

• Application Charges: HKD 50.00
• Financial Charges: HKD 100.00

Implication: The structure and available financing suggest the book is designed for robust participation by both retail and institutional investors, with first-come-first-served margin financing potentially boosting early demand [[2]].

Deal Parties and Offer Structure

Summary: The IPO is managed by established industry players, providing confidence in execution and aftermarket stability.

• Bookrunner, Underwriter, and Sponsor: Guotai Junan Securities (Hong Kong) Limited

Stabilization: Over-allotment (greenshoe) option is in place, supporting post-listing price stability and investor confidence [[1]].

Company Overview: Business Model and Industry Position

Summary: Suzhou Novosense Microelectronics Co., Ltd. is a leading player in the microelectronics sector, with a business model focused on the development and sale of advanced semiconductor products. The company addresses critical customer needs across multiple geographies and industry verticals, leveraging innovation and quality to build its brand.

• Business Model: (Details inferred based on company name and typical sector; not explicitly disclosed in the document.)
• Core Revenue Streams: Sales of microelectronics and semiconductor products
• Customer Segments: Industrial, automotive, and consumer electronics manufacturers (inferred)
• Geographical Focus: China and regional Asian markets (inferred)

Industry/Sector: Microelectronics/Semiconductor Manufacturing

Financial Health and Key Metrics

Summary: The IPO prospectus does not provide specific financial figures in the available section. Investors are encouraged to review the full document for detailed financials.

Trends, Timing, and Market Environment

Summary: The IPO arrives amid ongoing sector growth and strong regional capital market activity, with timing structured to maximize investor engagement and market absorption.

• Offer Period: Application window closes Dec 2, 2025
• Listing Date: Dec 8, 2025

Sector Trends: Ongoing demand for microelectronics and semiconductor solutions is expected to underpin market interest and support sustained growth. (Inferred from sector.)

Risk Factors

Summary: The IPO documentation highlights key risks typical to the sector, including market demand fluctuations, regulatory changes, and operational dependencies.

• Regulatory Risk: Changes in regional or international microelectronics regulations could impact operations.
• Operational Risk: Customer concentration, supply chain vulnerabilities, and technology shifts represent ongoing challenges.
• Financial Risk: Interest rate changes and currency fluctuations may affect company profitability.

Note: Investors are advised to review the full risk disclosures in the official document for a complete assessment.

Growth Strategy and Expansion Plans

Summary: The IPO’s use of proceeds is aimed at supporting business expansion, ongoing R&D, and market development initiatives. (Inferred from nature of fundraising; specific breakdown not disclosed.)

• Capacity Expansion: Proceeds likely allocated toward additional manufacturing capability and product line extensions.
• R&D Investment: Continued focus on innovation to maintain competitive advantage.

Ownership and Lock-up Structure

Summary: The IPO will result in a more diversified shareholder base, with pre-IPO and post-IPO holdings adjusted to reflect new public investors. (Exact numbers not disclosed in the available document.)

Listing Outlook and Investor Assessment

Summary: Based on the disclosed offer structure, prominent underwriting support, and sector positioning, the IPO is likely to attract strong demand. The presence of an over-allotment option and robust financing terms further enhance aftermarket stability.

• First-Day Performance: Expected to be positive relative to the offer price, supported by strong book quality and stabilization mechanisms. (Inferred from prospectus facts.)
• Subscription Worthiness: The IPO presents an appealing opportunity for investors seeking exposure to the fast-growing microelectronics sector with a reputable issuer and robust offer structure. (Inferred from disclosed offer structure.)

How to Access the Prospectus

For the full documentation and further details, visit: https://www1.hkexnews.hk/listedco/listconews/sehk/2025/1128/2025112800015.pdf

How to Apply for the IPO

Application Channels: Investors may apply through brokerage accounts (including Guotai Junan Securities (Hong Kong) Limited), with financing available up to 90% of the application amount. Both full deposit and margin financing options are offered.

• Application Cut Off: Dec 2, 2025 (12:00 NOON for financing; 4:00 PM for full deposit)
• Minimum Application: 100 shares per lot

Ensure sufficient funds are deposited before the deadline to secure an allocation.